Infineon Technologies has shown first samples of the 65 nanometer (nm) embedded flash (eFlash) microcontrollers (MCUs) targeting chip card and security applications. This results from the development and production partnership for 65nm eFlash MCUs Infineon and TSMC established in 2009.

First products to be ramped in high volume will be security controllers for SIM card applications. Process and product qualification is scheduled for the second half of 2012. The production on 65nm technology means a considerable advantage due to a gain in efficiency through significantly reduced chip sizes in comparison to former technologies. Additionally, the production based on 300mm wafers compared to 200mm leads to further increased productivity.

“We are proud to present first results of our successful partnership with TSMC for the 65nm eFlash technology,” said Pantelis Haidas, Division Vice President Operations of Chip Card & Security at Infineon Technologies. “We have enabled this state-of-the-art 300mm wafer-based technology in a production environment fully certified according to the Common Criteria for Information Technology Security Evaluation. Thus, we created a foundation for providing a broad range of chip card and security applications within the next years.” [www.infineon.com]